Global Specialties Solderless Breadboard with 470 Tie-points (EXP-355)The Global Specialties EXP 355 has 470 tie points and offers unlimited circuit design expansion though its unique molded in interlocking edge rails. It offers 0. 3" DIP spacing, and its unique molded in mounting holes allow for either front or rear mounting. Molded interlocking edge rails on all four sides permit parallel or perpendicular socket arrays, allowing more boards to be added at any point for maximum circuit design flexibility. The
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Global Specialties Solderless Breadboard with 470 Tie-points (EXP-355)